With the rapid development of emerging technologies such as artificial intelligence, 5G communications and high-performance computing, the semiconductor industry is undergoing a technological transformation with advanced packaging at its core. In this change, 2.5D and 3D packaging technology has become the dark horse of the industry, leading the semiconductor industry to higher performance and lower power consumption. As a global chip foundry giant, TSMC's market value has approached $1 trillion, which fully reflects the market's optimism about advanced packaging technology.
Advanced packaging technology has become the key to breaking through Moore's Law
In traditional semiconductor manufacturing, improving chip performance mainly relies on breakthroughs in advanced manufacturing processes. However, with the gradual slowdown of Moore's Law, it is difficult to meet the market's demand for chip performance by relying solely on process improvement. Under this background, advanced packaging technology emerged and became the key to break through the performance bottleneck. Guotai Junan Securities Electronics team predicts that by 2028, 2.5D and 3D packaging will become the second largest advanced packaging form after wafer-level packaging. This technology can not only improve the performance and integration of the chip, but also effectively reduce power consumption, providing strong support for fields such as AI and high-performance computing.
Semiconductor giants compete for layout, and the industrial chain ushered in new opportunities
In the face of the huge market opportunities brought by advanced packaging technology, major semiconductor giants have increased layout efforts. Samsung Electronics has announced a major restructuring of its semiconductor business unit, creating a new HBM research and development team to focus on the development of HBM3, HBM3E and next-generation HBM4 technologies. At the same time, Samsung is also reorganizing the Advanced packaging (AVP) team and equipment technology laboratory to enhance the overall technical competitiveness. The move underscores Samsung's ambitions in advanced packaging. At the same time, domestic leading enterprises such as Changdian Technology, Tongfu Micro electricity and Huatian Technology are also actively layout, and launched innovative technologies such as XDFOI Chiplet high-density multidimensional heterogeneous integration series process, contributing to the improvement of China's semiconductor industry chain. With the continuous improvement of the industrial chain and the continuous breakthrough of technology, it is expected that by 2035, the global Chiplet market is expected to reach 57 billion US dollars, with a compound annual growth rate of 30.16%. This huge market space will undoubtedly bring new development opportunities for the entire semiconductor industry chain.
This article is from: Finance
Author: Ju Ling